BSI结构需要额外的waferbonding及thinning，背面对准处理（alignmentfor backside process）及背面界面钝化（passivation）等工艺，要求容差非常小，工艺复杂。下表是常用的两种BSI结构工艺，不论采用哪种BSI结构，都需要waferbonding工艺。 以SONY为代表的SOI结构，其成本提高4~5 ...

The German production manufacturer has announced the development of a new process for the texturing of diamond wire cut multi silicon wafers. Schmid says that it will ship the first systems featuring ...

US-Based wafer producer 1366 Technologies and ‘Silicon Module Super League’ (SMSL) member Hanwha Q CELLS have jointly hit a new record of 19.6% efficiency for cells using 1366's 'Direct wafer' process ...

Austin, July 26, 2024 (GLOBE NEWSWIRE) -- The Wafer Process Control Equipment Market Size was valued at USD 7.93 billion in 2023 and is estimated to reach USD 14.06 billion by 2032 and grow at a CAGR ...

A variety of deposition methods for two-dimensional crystals have been demonstrated; however, their wafer-scale deposition remains a challenge. Here we introduce a technique for depositing and ...

The global market for DRAM Wafer was valued at USD 12360 Million in the year 2024 and is projected to reach a revised size of USD 18560 Million by 2031, growing at a CAGR of 6.0% during the forecast ...

US-Based wafer producer 1366 Technologies and ‘Silicon Module Super League’ (SMSL) member Hanwha Q CELLS have jointly achieved cell conversion efficiencies of 19.9%, up from 19.6% announced in ...

Crystalline quartz films grown on four-inch silicon wafers detect Chikungunya virus at sensitivities surpassing standard ...