Dublin, March 20, 2025 (GLOBE NEWSWIRE) -- The "Semiconductor Wafer Polishing & Grinding Equipment Market by Equipment Type (Grinding Equipment, Polishing Equipment), Wafer Size (200 mm Wafers, 300 mm ...

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JTEKT Toyoda Americas recently demonstrated a new double-disc horizontal grinder – calling it “an industry first” – that simultaneously grinds both sides of silicon wafers to +/- 1 micron from ...

Wafers are transported between stages in the EFEM and cleaning module. In the grinding module, the wafers move from rough grinding to finish grinding as the index table rotates. To improve the ...

DUBLIN--(BUSINESS WIRE)--The "Wafer Backgrinding Tape Market by Type and Wafer Size: Global Opportunity Analysis and Industry Forecast, 2019-2026" report has been added to ResearchAndMarkets.com's ...

(MENAFN- GlobeNewsWire - Nasdaq) Market Shifts from Cost-Based to Value-Based Competition as Precision Engineering and Workflow Integration Gain Priority Dublin, March 20, 2025 (GLOBE NEWSWIRE) -- The ...

Taiwan startup Zhi He Technology has developed AI-based AOI (automated optical inspection) equipment that detects defects at diamond grinding wheels aiming to help boost wafer thinning efficiency. Zhi ...

To improve the performance of semiconductor circuits, “3D packaging technology,” which integrates circuits in three dimensions, has been attracting attention. However, due to issues like high cost and ...

The ultra-thin silicon wafers are only a quarter as thick as a human hair and half as thick as current state-of-the-art wafers of 40-60 micrometres. “Infineon’s breakthrough in ultra-thin wafer ...

After announcing the world’s first 300-millimeter gallium nitride (GaN) power wafer and opening the world’s largest 200-millimeter silicon carbide (SiC) power fab in Kulim, Malaysia, Infineon ...