NEW DELHI--(BUSINESS WIRE)--Cavli Wireless, a pioneer in the IoT solutions landscape, announced its flagship 5G RedCap CQM220 Cellular IoT Module at CES 2024, in Las Vegas, USA. The event, held at the ...
SAN DIEGO & BUENOS AIRES & LONDON & NEW DELHI & HONG KONG & BEIJING & TAIPEI & SEOUL--(BUSINESS WIRE)--Global cellular IoT module shipments reduced by 4% YoY and 28% QoQ during Q1 2020 due to the ...
THALWIL, SWITZERLAND / ACCESSWIRE / February 6, 2024 / u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technologies and services, has announced two new LTE-M ...
Global carrier and regulatory pre-certifications remove significant development burdens that device manufacturers typically face when integrating cellular connectivity. The standard XBee form factor ...
LAS VEGAS, January 02, 2026--(BUSINESS WIRE)--Quectel Wireless Solutions, an end-to-end global IoT solutions provider, today announces the launch of the world's first 5G-advanced (5G-A) ...
STERLING, Va., Jan. 15, 2026 (GLOBE NEWSWIRE) -- SKYWAVE™, an ORBCOMM ® company, today announced the launch of the ST 4000, a hybrid IoT module that delivers seamless global connectivity across ...
Quectel Wireless Solutions, an end-to-end global IoT solutions provider, today announces the launch of the world's first 5G-advanced (5G-A) automotive-grade cellular module, the AR588MA, establishing ...
The CQM200 5G NR Sub-6 IoT Module sets new benchmarks for data speeds and carrier aggregation, making it the ideal choice for high-bandwidth IoT solutions across Industry 4.0, smart cities, and beyond ...
U-blox unveiled its SARA-S520M10L cellular and satellite IoT module that delivers accurate, low-power positioning and ubiquitous connectivity. Designed for asset tracking, fleet management, maritime ...
Nordic Semiconductor, a developer of low-power wireless connectivity solutions, has announced that its nRF9151 cellular ...
U-blox has debuted the ALEX-R5, a miniature cellular module that integrates low power wide area connectivity and GNSS technology into an ultra-small system-in-package (SiP) form factor. According to u ...
一些您可能无法访问的结果已被隐去。
显示无法访问的结果