针对传统金属文物修复成本高、流程复杂的问题，本研究基于COMSOL Multiphysics构建三维电镀模型，模拟Cu-Sn合金在金杯表面的电沉积过程，揭示几何边缘效应导致电流密度不均（峰值达23,000 A/m2），通过参数优化实现81.25% Cu-Sn均匀涂层，并证实浓度极化对离子传输 ...

Multiphysics simulation helps engineers understand the interaction of thermal, structural, acoustic, fluid, and electromagnetic effects in complex systems. Accurate material properties are crucial; ...